Technology Development Quality and Reliability

Intel Corporation

Job Details:

Job Description: 

Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. So, join us and help us create the next generation of technologies that will shape the future for decades to come.

Intel’s Foundry Technology Development Quality and Reliability is seeking engineers for work in Chip Package Interaction Quality and Reliability of semiconductor processes.

Foundry Technology Development Quality and Reliability (Q&R) Engineering is a fast-paced, dynamic environment requiring decision-making at the strategic and tactical levels. The impact of Q&R decisions on silicon, package, and technology development makes the QRE position one of responsibility and high visibility.

The Far-Back-End Technology Development Reliability Engineer will be responsible for but not limited to:

  • Develop and qualify thermo-mechanical and environmental reliability for Intel’s products
  • Develop reliability requirements and test plans at component level targeted towards product use condition
  • Work closely with the technology development team and partner engineering groups to develop reliability requirements and manufacturing specifications
  • Design test vehicle and develop new characterization/detection technique and test specification (and kill limit) for early risk evaluation (Quick Turn Monitor, QTM)
  • Understand the reliability of physics, and the influence of material/design/test-method/statistical process control
  • Formulate DR (Design Rule), monitoring structure to enable design for reliability and Influence architectural decisions early-on
  • Identify critical parameters to develop a robust evaluation plan or comparative assessment between process/vendor options
  • Develop cost-effective production monitoring and screening schemes to ensure process stability and product quality and reliability commitment
  • Knowledge of statistics, DOE (Design of experiment), TGA (Technical gap analysis), FMEA (Failure Modes and Effects Analysis), MBPS (Model-based problem solving), knowledge-based qualification, and standards

The ideal candidate should exhibit the following behavioral traits:

  • Analytical problem-solving
  • Planning, prioritizing, and goal setting
  • Bias for action and ownership
  • Problem solving in a complex environment dealing with stakeholder.
  • Ability to work within a team environment with effective communications skills and able to cultivate new connections and working partnerships.
  • Ability to work independently and drive resolution to new challenges and proliferate those learnings to VF partners.
  • Take initiative to solve problems.
  • Demonstrated project management skillset.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Ph.D. in Mechanical Engineering, Aeronautical Engineering, Materials Science, Physics, or related field of study

OR

  • A Masters with 3+ years of Solid mechanics and Fabrication processing experience

OR

  • A Bachelor’s with 4+ years of Solid mechanics and Fabrication processing experience

Preferred qualifications:

  • Solid mechanics and Fabrication processing experience
  • Experience in empirical data collection and statistical data analysis, reliability statistics, and design of experiment
  • Experience in semiconductor packaging
  • Knowledge of semiconductor processing and associated materials
  • Familiarity with a range of imaging and analytical lab test equipment such as acoustic and x-ray imaging, SEM/ EDX/TEM/EEL techniques
  • Experience in programming with formal language C, C++, C, etc., and scripting language AWK, PERL, Python, SQL, TCL, and VBScript

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Business group:

As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

To apply for this job please visit www.whatjobs.com.

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